变化四：新兴先进封测技术的兴起CoWoS先进封装可谓HBM的黄金搭档。随着全球对于高性能计算（HPC）及人工智能（AI）芯片需求的持续增长，也推动了对于台积电CoWoS（Chip on Wafer on Substrate）先进封装产能的需求暴涨，虽然台积电持续扩大产能，但依然难以满足市场需求，成为了限制HPC及AI芯片产能的另一关键瓶颈。这也使得部分客户考虑寻求台积电CoWoS以外的替代方案，其中就包括英特尔的EMIB-T先进封装技术。
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上週五的判決，也讓週二特朗普在國會聯席會議發表年度國情咨文時，場面要變得有些尷尬。因為，傳統上，許多最高法院大法官會坐在議事廳前排。
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Once the basic stuff was working, I wanted to load TAP files directly, simulating cassette loading. This was the first time the agent missed a few things, specifically about the timing the Spectrum loading routines expected, and here we are in the territory where LLMs start to perform less efficiently: they can’t easily run the SDL emulator and see the border changing as data is received and so forth. I asked Claude Code to do a refactoring so that zx_tick() could be called directly and was not part of zx_frame(), and to make zx_frame() a trivial wrapper. This way it was much simpler to sync EAR with what it expected, without callbacks or the wrong abstractions that it had implemented. After such change, a few minutes later the emulator could load a TAP file emulating the cassette without problems.